Machines and equipments of company Kamea

Kulicke and Soffa 4500 Wire Bonders
Specification:
Au wire diameter: 12,7µm (min) - 76µm (max)
Al wire diameter: 20µm (min) - 76µm (max)
Bonding field: 135 mm x 135 mm
Maximal range of the table: 140 mm
Minimal step of the table: 14 mm
Temperature regulator: Až do 250° ± 5°C
Wire angle: 30°/45°

Surftens 3.0 measuring of contact angle and wettability
Specification:
Dimensions of the table: 100 mm x 100 mm
Height adjustability: 50 mm (max)
Range of contact angle measuring: 1° - 180°
Resolution / exactness: ± 0,05° / ± 0,5°
Change of optics angle: 0-6°
Camera (standard): CMOS Camera 1,3 MPx

Desktop Leed - Free Reflow Oven TYR108N
Specification:
Quantity of temperature zones: 1 zone with multiple temperature regulation
System of temperature regulation: Automatic temperature control by microcomputer
Temperature range: From temperature of room to 300 °C
Source of heat: Infrared light + warm air
Effective area of worktable: 350 mm x 250 mm
Nominal power: 4,5 kW (priemerný výkon 1,5 kW)
Dimensions: 620(L) x 460(W) x 385 (H)

Karl Suss MA56
Specification:
Exposition mode: Manual, semi-automatic of fully automatic
Dimensions of the table: 100 mm x 100 mm
Height adjustability: 50 mm (max)
Range of contact angle measuring: 1° - 180°
Resolution / exactness: ± 0,05° / ± 0,5°
Exposition optics: UV-400
Change of optics angle: 0-6°
Lamp: 350 W
Wave-length: 365 - 405 nm
Camera (standard): CMOS Camera 1,3 MPx
Power supply: 220 VAC - 50/60 Hz

Esec 3006 F/X bonders
Specification:
Method: Thermosonic connection of spheroidal wedges
Au wire diameter: 18 - 50 µm
Diameter of the spool: 5,08 cm
Width of the spool: 2,54 - 7,62 cm
Speed: 0,135 sec./drôt
Control of the loop: Automatic, fully programmable
Bonding area: 25,4 x 25,4 mm
Bonding force: 20 - 300 g
Wire feeding system: Motored feeding system
Camera: Integrated CCD camera with high resolution
Microscope zoom: x7 - x30
Dimensions (w x l x h): 850 x 850 x 1700 mm
Weight: 425 kg
Energy consumption: max. 2000 W
Compressed air: 5 - 6,5 bar

Esec Dicing Saw 8003
Specification:
Diameter of substratum disc (wafer): 25,4 - 152,4 mm (1" – 6")
Thickness of substratum disc (wafer): 0,01–5,0 mm
Minimal width of cut: 250 μm pre Si wafer
Minimal size of the chip: 1x1 mm
Axle X (shift): 240 mm
Axle Y (index): 165 mm
Index of the step: 0,02–100 mm
Axle Z (vertical): 10 mm
Angular displacement: 0,01–165 stupňov
Spindle speed: 15,000–50,000 rpm
Air pressure: 4,4 - 5,8 bar (64-85 psi)
Water pressure: do 5,8 bar (85 psi)

VS7 SMD Inspection System
Specification:
Camera: CCD kamera Sony
Scale: 4x - 60x
Requirements on camera power supply: DC 12V s výkonom 5W
Lamp: Halogen lamp
Lamp power: 270W
Requirements on system power supply: 230V; 50/60Hz; 115mA
Function on sloping imaging: Inspection of the board without its real sloping

Wild Macroscop M420
Specification:
Display head: Trinocular 25x
Ocular: Wild 10X/21
Diopric correction: +5 až -5
Approach: APO Zoom 6:1 ; Makrozoom 5:1
Range of approach: APO Zoom 7,3x - 43,8x ; Makrozoom 7,9x - 40x
Wirking distance: APO Zoom 102mm ; Makrozoom 100mm
Illumination: 20W / 6V
Display: Rotary, Full HD Video
Ports: HDMI
Dimensions: 27,3 x 29,7 cm
Stand: height - 300mm

Microscope Olympus BH2-UMA
Specification:
Illumination type: second light
Binocular angle: 45°
Ocular model: WHK 10x / 20L
Magnification of the oculare: 10x
Polariser: Yes
Working area dimensions (length x width) mm: 203 x 343
Outside dimensions (width x length x height) cm: 34,3 x 48,3 x 45,7
Power supply requirements: 115 V
Weight: 14 kg