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Machines and equipments of company Kamea

Kulicke and Soffa 4500 Wire Bonders

Specification:

Au wire diameter: 12,7µm (min) - 76µm (max)

Al wire diameter: 20µm (min) - 76µm (max)

Bonding field: 135 mm x 135 mm

Maximal range of the table: 140 mm

Minimal step of the table: 14 mm

Temperature regulator: Až do 250° ± 5°C

Wire angle: 30°/45°

Surftens 3.0 measuring of contact angle and wettability

Specification:

Dimensions of the table: 100 mm x 100 mm

Height adjustability: 50 mm (max)

Range of contact angle measuring: 1° - 180°

Resolution / exactness: ± 0,05° / ± 0,5°

Change of optics angle: 0-6°

Camera (standard): CMOS Camera 1,3 MPx

Desktop Leed - Free Reflow Oven TYR108N

Specification:

Quantity of temperature zones: 1 zone with multiple temperature regulation

System of temperature regulation: Automatic temperature control by microcomputer

Temperature range: From temperature of room to 300 °C

Source of heat: Infrared light + warm air

Effective area of worktable: 350 mm x 250 mm

Nominal power: 4,5 kW (priemerný výkon 1,5 kW)

Dimensions: 620(L) x 460(W) x 385 (H)

Karl Suss MA56

Specification:

Exposition mode: Manual, semi-automatic of fully automatic

Dimensions of the table: 100 mm x 100 mm

Height adjustability: 50 mm (max)

Range of contact angle measuring: 1° - 180°

Resolution / exactness: ± 0,05° / ± 0,5°

Exposition optics: UV-400

Change of optics angle: 0-6°

Lamp: 350 W

Wave-length: 365 - 405 nm

Camera (standard): CMOS Camera 1,3 MPx

Power supply: 220 VAC - 50/60 Hz

Esec 3006 F/X bonders

Specification:

Method: Thermosonic connection of spheroidal wedges

Au wire diameter: 18 - 50 µm

Diameter of the spool: 5,08 cm

Width of the spool: 2,54 - 7,62 cm

Speed: 0,135 sec./drôt

Control of the loop: Automatic, fully programmable

Bonding area: 25,4 x 25,4 mm

Bonding force: 20 - 300 g

Wire feeding system: Motored feeding system

Camera: Integrated CCD camera with high resolution

Microscope zoom: x7 - x30

Dimensions (w x l x h): 850 x 850 x 1700 mm

Weight: 425 kg

Energy consumption: max. 2000 W

Compressed air: 5 - 6,5 bar

Esec Dicing Saw 8003

Specification:

Diameter of substratum disc (wafer): 25,4 - 152,4 mm (1" – 6")

Thickness of substratum disc (wafer): 0,01–5,0 mm

Minimal width of cut: 250 μm pre Si wafer

Minimal size of the chip: 1x1 mm

Axle X (shift): 240 mm

Axle Y (index): 165 mm

Index of the step: 0,02–100 mm

Axle Z (vertical): 10 mm

Angular displacement: 0,01–165 stupňov

Spindle speed: 15,000–50,000 rpm

Air pressure: 4,4 - 5,8 bar (64-85 psi)

Water pressure: do 5,8 bar (85 psi)

VS7 SMD Inspection System

Specification:

Camera: CCD kamera Sony

Scale: 4x - 60x

Requirements on camera power supply: DC 12V s výkonom 5W

Lamp: Halogen lamp

Lamp power: 270W

Requirements on system power supply: 230V; 50/60Hz; 115mA

Function on sloping imaging: Inspection of the board without its real sloping

Wild Macroscop M420

Specification:

Display head: Trinocular 25x

Ocular: Wild 10X/21

Diopric correction: +5 až -5

Approach: APO Zoom 6:1 ; Makrozoom 5:1

Range of approach: APO Zoom 7,3x - 43,8x ; Makrozoom 7,9x - 40x

Wirking distance: APO Zoom 102mm ; Makrozoom 100mm

Illumination: 20W / 6V

Display: Rotary, Full HD Video

Ports: HDMI

Dimensions: 27,3 x 29,7 cm

Stand: height - 300mm

Microscope Olympus BH2-UMA

Specification:

Illumination type: second light

Binocular angle: 45°

Ocular model: WHK 10x / 20L

Magnification of the oculare: 10x

Polariser: Yes

Working area dimensions (length x width) mm: 203 x 343

Outside dimensions (width x length x height) cm: 34,3 x 48,3 x 45,7

Power supply requirements: 115 V

Weight: 14 kg